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PAP7501V PAP7501V USB2.0 PC Camera Controller General Description The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0 standard.Internal controller can be power-up loaded from external EEPROM. This allows customization of VID, PID, product string, sensor parameters...etc. Features .USB Features USB 2.0 and 1.1 compliance(high speed and full speed transceiver). USB video class 1.1 compliance. USB audio class 1.0 compliance. Key Specification Supply Voltage Resolution Frame Rate System Clock 5.0V 10% Up to 640 (H) x 480 (V) Up to 30fps 12MHz <100mA .Micro Controller Features Built-in 8 bit micro controller with 40K-byte of mask Power consumption ROM and 24K-byte SRAM. Firmware supports AE, AWB, and USB protocol. Programmable codes uploaded from serial EEPROM/Flash. .Sensor Controller Features. Support up to VGA CMOS image sensors. Support 8 bit raw image data or YUV2 input from CMOS sensor. On chip color processor engine. Built-in MJPEG encoder. Support 2 wires serial interface for sensor control. . Audio Controller Features Audio interface: -Built in 10 bit mono audio ADC for audio recording through microphone. -Sampling rate @16/48kHZ, resolution 16 bits format. Recording, mute and volume control. . Miscellaneous Features Power consumption: < 100mA USB 5V power in, on-chip 3.3V regulator for IO PAD and PHY, on-chip 1.8V regulator for core logic. Ordering Information Order number PAP7501V Package Type 48-pin QFN Package Size(mm) 5.53 x 5.53 All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 1 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 1. Pin Assignment Pin# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Name GND33A_PLL_I VDD5MA VDD28A_MIC VCOM MIC_P MIC_N VDD33A_PGA VSSA VDD33A_ADC VSSQ RSTN SEN_CSB KEY GPIO4 VDD18K VDD33Q SEN_CLK SEN_SCL SEN_SDA I_VSYNC I_HSYNC EPR_CSB EPR_SO EPR_SI EPR_SCK I_PXD7 I_PXD6 I_PXD5 I_PXD4 I_PXD3 I_PXD2 I_PXD1 I_PXD0 I_PXCLK VDD5MD VDDAYS VDD5MV VSSQ VDD33A_HSRT_O VDD18K OSC_IN OSC_OUT VDD33A_HSRT_I GND33A_HSRT_I RRET DM DP VDD33A_PLL_I Type GND PWR BYPASS BYPASS IN IN BYPASS GND BYPASS GND IN OUT IN I/O BYPASS BYPASS OUT OUT I/O IN IN IN IN OUT OUT IN IN IN IN IN IN IN IN IN PWR BYPASS PWR GND BYPASS BYPASS IN OUT BYPASS GND IN I/O I/O BYPASS Description Ground for PLL 5V Power for analog circuit Analog power for Audio MIC, 2.8V Microphone common mode voltage reference Microphone positive input Microphone negative input Analog power for Audio PGA, 3.3V Microphone GND Analog power for Audio ADC, 3.3V Digital ground Chip power up reset (Internal pull-up 100Kohm) Chip select of EEPROM Snapshot control signal (Active Low, internal pull-up 100Kohm) General purpose I/O Logic power for digit circuit, 1.8V Logic power for digit circuit, 3.3V Clock output for sensor I2C clock I2C data Vertical synchronization signal Horizontal synchronization signal Chip Select of EEPROM Data out of EEPROM Data input of EEPROM Serial clock of EEPROM Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor pixel clock input 5V power for digit circuit Logic power for digit circuit, 2.5V 5V power for PHY circuit Digital ground Analog power for TX/RX Logic power for digit circuit, 1.8V Crystal input Crystal output Analog power for TX/RX Ground for USB TX/RX Reference supply current for PHY DM for USB PHY DP for USB PHY Analog power for PLL All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 2 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 2.Block Diagram The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0 standard. It integrates micro-controller, color processor engine, MJPEG encoder, and 24K-byte programmable SRAM. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 3 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 3. Specifications Absolute Maximum Ratings Exceeding the Absolute Maximum Ratings shown below invalidates all AC and DC electrical specifications and may result in permanent device damage. Symbol TSTG VDD VIN VOUT ESD Parameter Ambient storage temperature DC supply voltage DC input voltage DC output voltage ESD Rating, Human Body model Min -25 -0.5 0.5 -0.5 Max 125 5.5 3.8 3.8 2 Unit C V V V kV Notes Recommend Operating Condition Symbol TA VDD FCLK Parameter Temperature Operation Range Stable Image Power supply voltage System clock frequency Min -10 0 4.5 Typ. 5.0 12.0 Max 70 50 5.5 Unit C C V MHz Notes DC Electrical Characteristics (Typical values at 25C, VDD =5.0V, FCLK=12.0MHz) Symbol Type: PWR IDD IPWDN Operating Current Power Down current 70 500u mA @30 frame/sec Parameter Min. Typ. Max. Unit Notes Type: IN & I/O, Reset VIH VIL Input voltage HIGH Input voltage LOW V V Type: OUT & I/O VOH VOL Output voltage HIGH Output voltage LOW 0.9 x VDD33Q - 0.1 x VDD33Q V V - All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 4 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4. Packing Information 4.1 Product Ordering Information Product Number : PAP7501 V QFN 6*6 48L with lead-free process Part Number 4.2 Material List 4.3 Package Outline Dimension Saw Type(A type): All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 5 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera Punch Type(U type): 4.4 Pin Assignment All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 6 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.5 Recommended Layout PCB All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 7 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.6 Packing Information Anti-static PP band Tray (11 pcs) Static Shielding Bag PART NO. : LOT NO. QTY QA : : : Label PACKING BOX ELECTROSTATIC SENSITIVE DEVICES CAUTION LABEL One packing box capacity One packing box Remark Tray durable temperature = 150 Note: 1. When the units is out of dry packing, should be operation at : Temperature = 30 , Humidity = 60% RH 4900 units ( 490 units x 10 Trays) 2. If units is out of dry packing over 168 hrs, before go through infrared reflow process must be bake with 125 the moisture. 5 @24hrs, to remove All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 8 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.7 Recommended Condition For Infrared Reflow Carefully observe the mounting conditions, recommended temperature profile when Mounting infrared reflows is show in the figure below. Melting area Pre-heat ( Sec ) Recommend Pb-free solder paste vender & type : 1. Almit LFM-48W TM-HP 2. Senju M705-GRN360-K Programming rate 1.5~2.5 oC/sec Pre-heat 170~200oC 90 +/- 30 sec Melting area >220oC 30~50sec with peak temperature 230~245oC All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 9 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.8 Handling precaution for the prevention of ESD Explained below are procedures that must be taken in fabrication to prevent the electrostatic destruction of semiconductor devices. The following basic rules must be obeyed. 1. Equalize potentials of terminals when transporting or storing. 2. Equalize the potentials of the electric device, work table, and operator's body that may come in contact with the IC's. 3. Prepare an environment that does not generate static electricity. One method is keeping relative humidity in the work room to about 50%. Operator 1. The operator should wear wrist straps. (Must maintain electric contact with bare skin) 2. Wear cotton or antistatic-treated materials clothes and gloves. 3. When a conductive mat will be used, must be ware conductive shoes. 4. Do not touch the IC's leads. Touch the body of IC's when holding. Equipment and tools 1. Any electrical equipments and tools located on the work table surface must be isolated from The work table surface, and ground the equipments and tools that are to be used. 2. Work table surface must be use conductive material or conductive mat. (Should be ground through a 1M Transporting, storing and packing 1. Use conductive IC's tray, and conductive or shielding bag to store IC's. Soldering operation 1. Use a soldering iron with a grounding wire. 2. When perform manual soldering operation, the operator should wear wrist straps. 3. Do not use the desoldering pump when removing the IC's from the PCB board. Use a solder-wick or equivalent. resistor) All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 10 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 5. Reference Application Circuit 5.1 PAP7501 with PAS6311 I_HSYNC I_VSYNC I_PXCLK VDDAY VDDQ VDD33A_PLL_I VDDA VDDAY RESET U1 C3 0.1u D5 B5 C4 E5 E4 A2 CON1 R2 C9 4.7nF/250V VDD18K 8 9 USB_SHADING C12 I_PXCLK 5 4 3 2 1 GND33A_HSRT_O HC3 HC4 HC2 HC1 7 6 USB_SHADING C31 1u C10 10pF C11 10pF MINI USB 5P 10M SEN_SDA VDDAY S SEN_SCL C8 0.1u C7 4.7u + VDD5MV SEN_CSB VDDA VDD33A_HSRT_I C4 0.1u C30 0.1u C1 1u VDD33A_HSRT_I C2 1u VDDQ D3 D4 D2 C5 A5 E3 VDDQ PXCLK HSYNC VDDAY VSYNC VDDD R1 100k VDD33A_HSRT_O C5 1u VDD33A_PLL_I VDD33A_HSRT_O SEN_CLKE2 RESET E1 D1 I_PXD7 I_PXD6 A4 B4 A1 SY SCLK RESET VSSD PX9 PX8 PX0 PX7 PX6 CSB VDDA PAS6311LT VSSA SDA SCL PX1 PX5 PX4 PX3 C1 I_PXD1 VDDQ VDD33Q I_PXD5 I_PXD4 I_PXD3 I_PXD2 I_PXD0 C2 A3 B3 B2 B1 PX2 GND2 NC + +5V VDDA VDDAY S R3 1M Y 1 12MHz Note: xx_N_M=> No Mount R4 12k D+ DVDD33A_HSRT_O VDD33A_HSRT_I VDD33A_PLL_I OSC_OUT OSC_IN VDD5MV 37 VDD18K 20pF_N.M. C14 D+ DC13 C15 C16 22u 22u 0.1u VDD28A_MIC C17 C18 10u VCOM R5 0.01u + C19 C20 1u VDD33A_PGA R6 R8 2.2k 10k C21 1u VDD33A_ADC X1 + C22 C23 2.2u 2.2u C32 MICROPHONE R9 VDD33A_ADC 2.2k VSSQ WP R10 100k 100k VDD33Q VDD33Q C24 R12 1uF 300k RSTN SEN_CSB 10 11 12 9 C33 0.47uF_N.M. 0.47uF_N.M. VDD33A_PGA VSSA 7 8 10k VCOM MIC_P MIC_N 4 5 6 R7 VDD28A_MIC 3 5.1k 22u 1 VCOM VDD5MA 2 GND33A_PLL_I VDD5MA VDD28A_MIC VCOM MIC_P MIC_N VDD33A_PGA VSSA VDD33A_ADC VSSQ RSTN SEN_CSB + VDD28A_MIC SEN_CLK + + 20pF_N.M. VSSV USB_5V 48 47 46 45 44 43 42 41 40 39 VDD33A_HSRT_O XSCO VDD33A_PLL_I GND33A_HSRT_I VDD33A_HSRT_I VDD18K RREF VSSQ DP DM XSCI 38 U2 VSSQ VDDAY S VDD5MD I_PXCLK I_PXD0 I_PXD1 PAP7501_48P I_PXD2 I_PXD3 I_PXD4 I_PXD5 I_PXD6 I_PXD7 EPR_SCK 36 35 34 33 32 31 30 29 28 27 26 25 VDDAY S VDD5MD I_PXCLK I_PXD0 I_PXD1 I_PXD2 I_PXD3 I_PXD4 I_PXD5 I_PXD6 I_PXD7 EPR_SCK EPR_HOLD R11 EPR_CSB SEN_SDA SEN_CLK SEN_SCL I_HSYNC I_VSYNC EPR_SO 23 EPR_SO VDD33Q VDD18K VDD33Q R13 GPIO_4 C25 20pF_N.M. R17 1K 1 25F512A 13 14 15 16 17 18 19 20 21 22 SEN_SDA VDD33Q GPIO_4 VDD18K LED-0603 USB_5V VDD5MV VDD5MD VDD5MA VDD5MV C28 L1 1 L2 1 L4 1 1uF_N.M. VDD5MD C34 3.3u 2 3.3u 2 1uF_N.M. 2 SEN_CSB U4 KEY C6 1u R14 R15 10k 10k L3 VDD33Q VDD33Q 3.3uH VSSA 3.3u 2 1uF_N.M. C26 C27 10u 0.1u VDD5MA C35 + GPIO_4 VDD33Q R16 100k C29 1u EPR_SI D1_Green KEY I_HSYNC EPR_CSB SEN_CLK SEN_SCL I_VSYNC 24 EPR_SI KEY EPR_CSB 100k EPR_SO WP GND 1 2 3 4 CS VCC SO HOLD WP SCK GND SI 8 7 6 5 VDD33Q EPR_HOLD EPR_SCK EPR_SI VDD33Q U3 All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 11 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 6. Update History Version V1.0 V1.1 Update Creation, Preliminary 1st version Update circuit and Package information, Add C30~C35, R17, D1, Change R5 to 5.1k ohm, R6 and R9 Change to 2.2k ohm Date 01/17/2008 05/06/2008 All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 12 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 |
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